Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Effect of die/substrate thickness ratio on Al pad stresses, under a

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Electrodeposition and characterization of copper nanocone structures

A review of helical nanostructures: Growth theories, synthesis strategies and properties

The effect of lanthanum chloride on the electrocrystallization behavior of cobalt and grain refinement in deposition layers

Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

蕴雯 WU, Waseda University, Tokyo, Sōdai, Department of Applied Chemistry

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Advance in additive manufacturing of 2D materials at the atomic and close-to-atomic scale

Low Temperature Cu-Cu Bonding Technology in 3D Integration: An Extensive Review

蕴雯 WU, Waseda University, Tokyo, Sōdai, Department of Applied Chemistry

Materials, Free Full-Text