Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds
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Advances in Epoxy Molding Compounds - Dexter Technical Paper (1992)
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Electronics, Free Full-Text
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The coefficient of thermal expansion
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Designing Poly(vinylidene fluoride)-Silicon Carbide Nanowire Composite Structures to Achieve High Thermal Conductivity
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Comparing Power Transistors Operating at HighTemperature Tj200C Knowing the Transistors in Designs - Technical Articles
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Composite molding compound replaces Invar for lightweight small satellite structures
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WO1999032553A1 - Epoxy mold compound and method - Google Patents
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Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound - ScienceDirect
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Thermally Conductive Epoxy Adhesives
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Thermal Analysis in Advanced Packaging Materials iST - Decoding Thermal Characteristics in Advanced Packaging Materials
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PDF) Development of Mold Compounds With Ultralow Coefficient of Thermal Expansion and High Glass Transition Temperature for Fan-Out Wafer-Level Packaging