a) Under-bump metallization and micro-bumps fabricated on the VLSI

Mehdi ASGHARI KHIAVI, University of Toronto, Toronto

Philip AMBERG Research profile

Ivan SHUBIN Research profile

a) SEM image showing a microbump with Cu under-bump metallization

a) Under-bump metallization and micro-bumps fabricated on the VLSI

Experimental investigation of electromigration failure in Cu–Sn–Cu

US6818545B2 - Low fabrication cost, fine pitch and high

Stevan DJORDJEVIC, Principal Silicon Photonic Engineer

Micromachines, Free Full-Text

Carbon Nanotubes as Microbumps for 3D Integration

PDF) UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration