Latest advance on seamless metal-semiconductor contact with

Semiconductor Packaging Materials

Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap - Semiconductor Digest

The interfacial properties of 2D metal-monolayer blue phosphorene heterojunctions and transport properties of their Field-effect transistors

Atomic-Scale Structure of Mo6S6 Nanowires

Researchers improve the performance of semiconductors using novel 2D metal

Edge Contact for Carrier Injection and Transport in MoS2 Field-Effect Transistors

Cong WANG, PhD Student, Chinese Academy of Sciences, Beijing, CAS, National Centre for Nanoscience and Nanotechnology

Latest advance on seamless metal-semiconductor contact with ultralow Schottky barrier in 2D-material-based devices - ScienceDirect

Recent advances in TMD interfaces with seamless contacts - Journal of Materials Chemistry C (RSC Publishing) DOI:10.1039/D2TC02734H

What is Rapid Thermal Processing (RTP) in Semiconductor Manufacturing

Recent advances in TMD interfaces with seamless contacts - Journal of Materials Chemistry C (RSC Publishing) DOI:10.1039/D2TC02734H

The interfacial properties of 2D metal-monolayer blue phosphorene heterojunctions and transport properties of their Field-effect transistors

Plasmon oscillations at 1T /2H-MoTe 2 phase boundaries. (a) A HAADF

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