The bond pad redistribution layer (polyimide 1) and the under bump
![](https://www.researchgate.net/publication/242290142/figure/fig1/AS:393273848942598@1470775200407/The-bond-pad-redistribution-layer-polyimide-1-and-the-under-bump-metallization-layer.png)
![](https://ars.els-cdn.com/content/image/1-s2.0-S0026271403000581-gr2.jpg)
Wafer level packaging having bump-on-polymer structure - ScienceDirect
![](https://www.researchgate.net/profile/Warren-Flack/publication/252871504/figure/tbl1/AS:393174884339716@1470751605386/figure-tbl1_Q320.jpg)
Warren FLACK, Vice President, PhD
![](https://d3i71xaburhd42.cloudfront.net/706a0edcb4ef854374789032bf6004a08d7f79ee/2-Figure1-1.png)
Figure 1 from Integrated 122-GHz Antenna on a Flexible Polyimide
![](https://www.faraday-tech.com/resources/img/Product/pic_WLCSPTurnkeyServiceFlow.jpg)
Faraday Technology Corporation-WLCSP Testing & Bumping Process
![](https://www.researchgate.net/profile/Warren-Flack/publication/253275799/figure/fig4/AS:340874618785797@1458282250406/Mask-linearity-plot-for-190m-and-96m-thick-HD-8000-polyimide-using-a-ghi-line_Q320.jpg)
Comparison of conventional polyimide process and positive acting
![](https://www.researchgate.net/profile/Warren-Flack/publication/238528634/figure/fig5/AS:339681293160498@1457997739764/Bossung-plots-of-160-nm-pitch-gate-structures-with-1500-nm-wide-gates-In-all-cases_Q320.jpg)
Warren FLACK, Vice President, PhD
![](https://www.analog.com/en/_/media/analog/en/landing-pages/technical-articles/chip-scale-packaging-helps-portable-medical-devices-save-size-and-weight/figure2.png?w=900&rev=2f40f491565547ffbd74a5a672e1667a&sc_lang=en)
Chip Scale Packaging Helps Portable Medical Devices Save Size and
![](https://www.mdpi.com/polymers/polymers-15-03895/article_deploy/html/images/polymers-15-03895-g011-550.jpg)
Polymers, Free Full-Text
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Fan-In Wafer/Panel-Level Chip-Scale Packages
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PDF) Redistribution layers (RDLs) for 2.5D/3D IC integration
![](https://m.horexspcb.com/photo/horexspcb/editor/20220630150107_33678.jpg)
China HongRuiXing (Hubei) Electronics Co.,Ltd. latest
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A review on numerical approach of reflow soldering process for
![](https://www.researchgate.net/publication/250155395/figure/fig1/AS:652228792688652@1532514870812/Bonding-process-of-the-ACF-flip-chip-package-a-before-bonding-and-b-after-bonding.png)
Bonding process of the ACF flip chip package; (a) before bonding
![](https://c5.rgstatic.net/m/4671872220764/images/template/default/profile/profile_default_m.jpg)
PDF) Characterization study of an aqueous developable